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? semiconductor components industries, llc, 2006 december, 2006 ? rev. 5 1 publication order number: mc10ep35/d mc10ep35, mc100ep35 3.3v / 5vecl jk flip?flop description the mc10/100ep35 is a higher speed/low voltage version of the el35 jk flip ? flop. the j/k data enters the master portion of the flip ? flop when the clock is low and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. the reset pin is asynchronous and is activated with a logic high. the 100 series contains temperature compensation. features ? 410 ps propagation delay ? maximum frequency > 3 ghz typical ? pecl mode operating range: v cc = 3.0 v to 5.5 v with v ee = 0 v ? necl mode operating range: v cc = 0 v with v ee = ? 3.0 v to ? 5.5 v ? open input default state ? q output will default low with inputs open or at v ee ? pb ? free packages are available *for additional marking information, refer to application note and8002/d. h = mc10 a = assembly location k = mc100 l = wafer lot 5r = mc10 y = year 3m = mc100 w = work week m = date code = pb ? free package alyw hp35 alyw kp35 marking diagrams* soic ? 8 d suffix case 751 tssop ? 8 dt suffix case 948r 1 8 1 8 1 8 see detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. ordering information http://onsemi.com 1 8 hep35 alyw 1 8 kep35 alyw 1 8 dfn8 mn suffix case 506aa 5r m 14 3m m 14 (note: microdot may be in either location)
mc10ep35, mc100ep35 http://onsemi.com 2 1 2 3 45 6 7 8 q v ee v cc figure 1. 8 ? lead pinout (top view) and logic diagram k q clk reset j j k r flip flop table 1. pin description pin clk* j*, k* ecl signal inputs function ecl clock inputs reset* ecl asynchronous reset q, q ecl data outputs table 2. truth table j l- l- h- h- x k l- h l h x reset l l l l h clk z z z z x qn+1 qn l h qn l z = low to high transition v cc positive supply v ee negative supply * pins will default low when left open. ep exposed pad must be connected to a sufficient thermal conduit. electrically connect to the most negative supply or leave floating open. table 3. attributes characteristics value internal input pulldown resistor 75 k internal input pullup resistor n/a esd protection human body model machine model charged device model > 4 kv > 200 v > 2 kv moisture sensitivity, indefinite time out of drypack (note 1) pb pkg pb ? free pkg soic ? 8 tssop ? 8 dfn8 level 1 level 1 level 1 level 1 level 3 level 1 flammability rating oxygen index: 28 to 34 ul ? 94 v ? 0 @ 0.125 in transistor count 77 devices meets or exceeds jedec spec eia/jesd78 ic latchup test 1. for additional information, see application note and8003/d.
mc10ep35, mc100ep35 http://onsemi.com 3 table 4. maximum ratings symbol parameter condition 1 condition 2 rating unit v cc pecl mode power supply v ee = 0 v 6 v v ee necl mode power supply v cc = 0 v ? 6 v v i pecl mode input voltage necl mode input voltage v ee = 0 v v cc = 0 v v i v cc v i v ee 6 ? 6 v v i out output current continuous surge 50 100 ma ma t a operating temperature range ? 40 to +85 c t stg storage temperature range ? 65 to +150 c ja thermal resistance (junction ? to ? ambient) 0 lfpm 500 lfpm 8 soic 8 soic 190 130 c/w c/w jc thermal resistance (junction ? to ? case) standard board 8 soic 41 to 44 c/w ja thermal resistance (junction ? to ? ambient) 0 lfpm 500 lfpm 8 tssop 8 tssop 185 140 c/w c/w jc thermal resistance (junction ? to ? case) standard board 8 tssop 41 to 44 c/w ja thermal resistance (junction ? to ? ambient) 0 lfpm 500 lfpm dfn8 dfn8 129 84 c/w c/w t sol wave solder pb pb ? free <2 to 3 sec @ 248 c <2 to 3 sec @ 260 c 265 265 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability.
mc10ep35, mc100ep35 http://onsemi.com 4 table 5. 10ep dc characteristics, pecl v cc = 3.3 v, v ee = 0 v (note 2) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit i ee power supply current 30 40 50 30 40 50 30 40 50 ma v oh output high voltage (note 3) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mv v ol output low voltage (note 3) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mv v ih input high voltage (single ? ended) 2090 2415 2155 2480 2215 2540 mv v il input low voltage (single ? ended) 1365 1690 1460 1755 1490 1815 mv i ih input high current 150 150 150 a i il input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. input and output parameters vary 1:1 with v cc . v ee can vary +0.3 v to ? 2.2 v. 3. all loading with 50 to v cc ? 2.0 v. table 6. 10ep dc characteristics, pecl v cc = 5.0 v, v ee = 0 v (note 4) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit i ee power supply current 30 40 50 30 40 50 30 40 50 ma v oh output high voltage (note 5) 3865 3940 4115 3930 4055 4180 3990 4115 4240 mv v ol output low voltage (note 5) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mv v ih input high voltage (single ? ended) 3790 4115 3855 4180 3915 4240 mv v il input low voltage (single ? ended) 3065 3390 3130 3455 3190 3515 mv i ih input high current 150 150 150 a i il input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. input and output parameters vary 1:1 with v cc . v ee can vary +2.0 v to ? 0.5 v. 5. all loading with 50 to v cc ? 2.0 v. table 7. 10ep dc characteristics, necl v cc = 0 v; v ee = ? 5.5 v to ? 3.0 v (note 6) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit i ee power supply current 30 40 50 30 40 50 30 40 50 ma v oh output high voltage (note 7) ? 1135 ? 1010 ? 885 ? 1070 ? 945 ? 820 ? 1010 ? 885 ? 760 mv v ol output low voltage (note 7) ? 1935 ? 1810 ? 1685 ? 1870 ? 1745 ? 1620 ? 1810 ? 1685 ? 1560 mv v ih input high voltage (single ? ended) ? 1210 ? 885 ? 1145 ? 820 ? 1085 ? 760 mv v il input low voltage (single ? ended) ? 1935 ? 1610 ? 1870 ? 1545 ? 1810 ? 1485 mv i ih input high current 150 150 150 a i il input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. input and output parameters vary 1:1 with v cc . 7. all loading with 50 to v cc ? 2.0 v.
mc10ep35, mc100ep35 http://onsemi.com 5 table 8. 100ep dc characteristics, pecl v cc = 3.3 v, v ee = 0 v (note 8) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit i ee power supply current 30 40 50 30 40 50 30 40 50 ma v oh output high voltage (note 9) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mv v ol output low voltage (note 9) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mv v ih input high voltage (single ? ended) 2075 2420 2075 2420 2075 2420 mv v il input low voltage (single ? ended) 1355 1675 1355 1675 1355 1675 mv i ih input high current 150 150 150 a i il input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. input and output parameters vary 1:1 with v cc . v ee can vary +0.3 v to ? 2.2 v. 9. all loading with 50 to v cc ? 2.0 v. table 9. 100ep dc characteristics, pecl v cc = 5.0 v, v ee = 0 v (note 10) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit i ee power supply current 30 40 50 30 40 50 30 40 50 ma v oh output high voltage (note 11) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mv v ol output low voltage (note 11) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mv v ih input high voltage (single ? ended) 3775 4120 3775 4120 3775 4120 mv v il input low voltage (single ? ended) 3055 3375 3055 3375 3055 3375 mv i ih input high current 150 150 150 a i il input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. input and output parameters vary 1:1 with v cc . v ee can vary +2.0 v to ? 0.5 v. 11. all loading with 50 to v cc ? 2.0 v. table 10. 100ep dc characteristics, necl v cc = 0 v; v ee = ? 5.5 v to ? 3.0 v (note 12) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit i ee power supply current 30 40 50 30 40 50 30 40 50 ma v oh output high voltage (note 13) ? 1145 ? 1020 ? 895 ? 1145 ? 1020 ? 895 ? 1145 ? 1020 ? 895 mv v ol output low voltage (note 13) ? 1945 ? 1820 ? 1695 ? 1945 ? 1820 ? 1695 ? 1945 ? 1820 ? 1695 mv v ih input high voltage (single ? ended) ? 1225 ? 880 ? 1225 ? 880 ? 1225 ? 880 mv v il input low voltage (single ? ended) ? 1945 ? 1625 ? 1945 ? 1625 ? 1945 ? 1625 mv i ih input high current 150 150 150 a i il input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 12. input and output parameters vary 1:1 with v cc . 13. all loading with 50 to v cc ? 2.0 v.
mc10ep35, mc100ep35 http://onsemi.com 6 table 11. ac characteristics v cc = 0 v; v ee = ? 3.0 v to ? 5.5 v or v cc = 3.0 v to 5.5 v; v ee = 0 v (note 14) ? 40 c 25 c 85 c symbol characteristic min typ max min typ max min typ max unit f max maximum frequency (see figure 2. f max /jitter) > 3 > 3 > 3 ghz t plh , t phl propagation delay to output differential r, clk to q, q 200 400 480 200 410 490 200 420 575 ps t rr reset recovery 150 80 150 90 150 100 ps t s t h setup time hold time 150 150 50 50 150 150 50 50 150 150 80 80 ps t pw minimum pulse width reset 550 400 550 400 550 400 ps t jitter cycle ? to ? cycle jitter (see figure 2. f max /jitter) 0.2 < 1 0.2 < 1 0.2 < 1 ps t r t f output rise/fall times q, q (20% ? 80%) 70 120 170 80 130 180 100 150 200 ps note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 14. measured using a 750 mv source, 50% duty cycle clock source. all loading with 50 to v cc ? 2.0 v. 0 100 200 300 400 500 600 700 800 900 0 1000 2000 3000 4000 5000 figure 2. f max /jitter frequency (mhz) 1 2 3 4 5 6 7 8 9
mc10ep35, mc100ep35 http://onsemi.com 7 figure 3. typical termination for output driver and device evaluation (see application note and8020/d ? termination of ecl logic devices.) driver device receiver device qd q d z o = 50 z o = 50 50 50 v tt v tt = v cc ? 2.0 v ordering information device package shipping ? mc10ep35d soic ? 8 98 units / rail mc10ep35dg soic ? 8 (pb ? free) 98 units / rail mc10ep35dr2 soic ? 8 2500 / tape & reel mc10ep35dr2g soic ? 8 (pb ? free) 2500 / tape & reel mc10ep35dt tssop ? 8 100 units / rail mc10ep35dtg tssop ? 8 (pb ? free) 100 units / rail mc10ep35dtr2 tssop ? 8 2500 / tape & reel mc10ep35dtr2g tssop ? 8 (pb ? free) 2500 / tape & reel mc10ep35mnr4 dfn8 1000 / tape & reel mc10ep35mnr4g dfn8 (pb ? free) 1000 / tape & reel mc100ep35d soic ? 8 98 units / rail MC100EP35DG soic ? 8 (pb ? free) 98 units / rail mc100ep35dr2 soic ? 8 2500 / tape & reel mc100ep35dr2g soic ? 8 (pb ? free) 2500 / tape & reel mc3100ep35dt tssop ? 8 100 units / rail mc3100ep35dtg tssop ? 8 (pb ? free) 100 units / rail mc100ep35dtr2 tssop ? 8 2500 / tape & reel mc100ep35dtr2g tssop ? 8 (pb ? free) 2500 / tape & reel mc100ep35mnr4 dfn8 1000 / tape & reel mc100ep35mnr4g dfn8 (pb ? free) 1000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc10ep35, mc100ep35 http://onsemi.com 8 resource reference of application notes an1405/d ? ecl clock distribution techniques an1406/d ? designing with pecl (ecl at +5.0 v) an1503/d ? eclinps i/o spice modeling kit an1504/d ? metastability and the eclinps family an1568/d ? interfacing between lvds and ecl an1672/d ? the ecl translator guide and8001/d ? odd number counters design and8002/d ? marking and date codes and8020/d ? termination of ecl logic devices and8066/d ? interfacing with eclinps and8090/d ? ac characteristics of ecl devices
mc10ep35, mc100ep35 http://onsemi.com 9 package dimensions soic ? 8 nb case 751 ? 07 issue ah seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
mc10ep35, mc100ep35 http://onsemi.com 10 package dimensions tssop ? 8 dt suffix plastic tssop package case 948r ? 02 issue a dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 0.80 1.10 0.031 0.043 d 0.05 0.15 0.002 0.006 f 0.40 0.70 0.016 0.028 g 0.65 bsc 0.026 bsc l 4.90 bsc 0.193 bsc m 0 6 0 6 seating plane pin 1 1 4 85 detail e b c d a g detail e f m l 2x l/2 ? u ? s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) ? t ? ? v ? ? w ? 0.25 (0.010) 8x ref k ident k 0.25 0.40 0.010 0.016 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. terminal numbers are shown for reference only. 6. dimension a and b are to be determined at datum plane ?w?.
mc10ep35, mc100ep35 http://onsemi.com 11 package dimensions dfn8 case 506aa ? 01 issue d notes: 1. dimensioning and tolerancing per asme y14.5m, 1994 . 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. ??? ??? ??? ??? a d e b c 0.10 pin one 2 x reference 2 x top view side view bottom view a l (a3) d2 e2 c c 0.10 c 0.10 c 0.08 8 x a1 seating plane e/2 e 8 x k note 3 b 8 x 0.10 c 0.05 c a b b dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.20 0.30 d 2.00 bsc d2 1.10 1.30 e 2.00 bsc e2 0.70 0.90 e 0.50 bsc k 0.20 ??? l 0.25 0.35 1 4 8 5 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc10ep35/d eclinps is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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